Assembling of Electronic Modules
The unique production ensures the manufacture of electronic modules using components of surface and pin mounting in plastic, ceramic and metal packages of from 0402 (1 mm x 0.5 mm) and BGA components of 55 mm x 55 mm (the pitch is 0.4 mm, the mass is up to 25 g), of domestic and foreign origins. The mounting accuracy is no worse than 17.0 microns at 6-Sigma. Surface Mounting The mounting is performed on two manufacturing lines designated for medium-size lot production. The basis for these lines is ‘Siplace’ Machines (‘Siemens’ Company, Germany). The total capacity of the lines is 45,000 components per hour. We can mount single-piece products using ‘Fritsch’ installation with capacity of 500 components per hour. Lead Through-Hole The LTH is performed manually. Pin components are soldered through holes in semi-automatic or manual modes. The board assembly dimensions are from 100x50 mm to 500x450 mm. At the end of assembling, the ‘Viscom’ installation (Germany) performs computer-aided optical check, and the ‘Rohde&Swarz’ installation performs X-ray check. Optional Features
Order Terms and Cost Price range per soldering point (VAT inclusive):
The terms of order fulfillment are from 3 days (providing that goods made on commission are used). There is a system of rush orders performed according specially negotiated terms.
Contacts: Chief of Research-and-Production Complex – Oleg E. Stepanov:
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Additional Materials:
- given price is approximate |